At last, an open, cross-vendor protocol standard for SMT assembly lines and thus a key building block for process-integration and the Smart Factory. We’ve often criticized the lack of standards in our blog, as in their absence, the electronics producers’’s integration costs increase significantly. Now there are definite signs of progress and so far, the direction is promising.
A small drawback is that some large manufacturers such as Panasonic, Fuji and others have not (yet) found the courage to join the initiative. But the doors are wide open and growing market pressure will no doubt determine the direction. In any case, these manufacturers can easily integrate the open standard into their solutions free of charge.
Currently, IPC and other standardization proposals are not integrated yet. This initiative obviously did not want to be hampered by their formalities, structures and processes. In view of the work done so far with regards to modern data standards, that’s understandable. The IPC’s blessing can no doubt always be sought once the initiative proves to be a success.
The coming weeks and productronica 2017 will be telling. For certain, however: The Hermes Standard is a great starting point towards tackling the big challenges faced by the SMT factory of the future.