5. February 2017
Flash Memory with Secure Element increase IoT security

Flash Memory with built-in security features: Flexible security for the Smart Factory

(image: copyright a-image) The basis of every Smart Factory concept is machine-to-machine (M2M) communication. Machines, sensors and actuators are connected to each other and with wider […]
10. February 2017
Guidelines for security in the IoT

IT security in Industry 4.0 – New guideline provides food for thought

(image: copyright Plattform Industrie 4.0) Supported by the Federal Ministry for Economic Affairs and Energy, the “Plattform Industrie 4.0” initiative has issued a new guideline: “IT […]
22. February 2017

APEX 2017 – Collaboration at every turn

(image: Scoop) As the electronics manufacturing industry heads home from San Diego, many will reflect on the last three days of exhibition and conference with a […]
11. April 2017

Progress! Manufacturers agree on open standard for M2M communication for SMT assembly lines

At last, an open, cross-vendor protocol standard for SMT assembly lines and thus a key building block for process-integration and the Smart Factory. We’ve often criticized […]
28. April 2017

Everything moves faster than expected: Impressions from the Digital Factory trade fair in Hanover

(images: (c) Peter Kronfeld) Imagine you stand in front of a monitor and a software developer asks what information you would like to receive from a […]
5. May 2017
Thomas Bliem talks about the Hermes Standard

“The Hermes Standard will replace SMEMA”

(image: copyright ASM Assembly Systems) So far, 17 equipment manufacturers from the SMT industry have come together to form “The Hermes Standard” initiative.  Their goal: create […]
29. May 2017
Trevor Galbraith, publisher and editor-in-chief Global SMT & Packaging

“The evolution of AI in the smart factory” – by Trevor Galbraith

(images: GlobalSMT, BBC) After meeting him at SMT Hybrid Packaging I asked Trevor Galbraith, publisher and editor-in-chief of Global SMT & Packaging for a guest commentary. […]
11. July 2017

SMT Hybrid Packaging 2017: Warm-up event for the Productronica show this fall

The SMT Hybrid Packaging trade shows suffers during Productronica years. Manufacturers hold many innovations back until the fall. 2017 was no exception. Only a few exhibitors […]
25. July 2017

MES-Integration of SMT shop-floor at BYD, China

ASM invited me to visit a number of electronic manufacturers in China and India. Why? All these companies teamed up with ASM and established ASM’s SmartNet, […]
28. July 2017
Gerald G. Wong, CEO of CIG

CIG: Why a „Dark Factory“ should not scare you

After my visit at BYD I travelled to CIG (Cambridge Industries Group), an ICT equipment manufacturer in Shanghai. Based on its strong in-house engineering division CIG […]